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Comparison and Analysis of the Experimental Stability of SemiconductorCooling and Forced Air Cooling in the Measurementof Thermal Conductivity by Steady-state Method
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QU Zhifeng, MA Yang, WEN Kai,LI Jinrong,XIONG Bowen, YANG Zhimin*
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School of Physies and Eleetrnie Information, Yan'an Universitly, Yan 'an 716000 , China
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Abstract
This study eritieally examines the limitations inherent in current steady state thermal eonduetivitexperimental apparatuses.To address these shortcomings, a novel setup is designed and established, integratedwith a sample holder, an adjustable regulated power supply , a digital high-precision four-channel thermometer.and a computer. A sample holder was designed and fabricated, ineorporating an aerylie plate, wing serews, aceramie heating element, and a heat sink.The thermal conductivities were tested under strong air cooling andsemiconductor heat dissipation, The results show that the up-data instrument can realize the synchronousmeasurement of temperature and time,Compared with the strong fan heat dissipation, the thermal conductivitysystem obtainedunder semiconductor heat dissipation is more stable and less noisy.The research results canprovide a relerenee for the design and aecunaey improvement of the thermal conduetivity measurement deviee othe steady state method.
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Published: 25 April 2025
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[1] |
CUI Xiuhua, MU Baoxia , JING Oun , J Xu.
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HE Linjia, WANG Runsong, YE Weihao, GAO Silan, LI Jianhao, YANG Chuping.
Measurement of Ice Thermal Conductivity Based on Heat Flow Sensor
[J]. Physical Experiment of College, 2023, 36(4): 1-5. |
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